SERIO 4000 Printer Platform
基于40多年的印刷机设计和应用经验，以及当前行业发展的要求，SERIO4000型印刷机，经过多次修订和升级，符合高端制造业的技术要求，以及工业4.0的最新要求。SERIO 4000 的特点之一是其动态可扩展性。 为不同用户，不同工艺，我们准备了多种专业的选配项或功能模块，甚至我们可以根据您的个性化需求做各种灵活调整。用户可以选择在机器出厂前配置好响应的选配项或功能，也可以选择在使用一段时间后根据实际需求再选配响应的选项或功能。
SERIO 4000 Back to Back Fully-Automatic
Space-Saving & Reduced to the Max
The SERIO 4000 Back to Back printing system is pointing the way, when there is a demand for floor-space. Due to its small footprint and smart design, the printer can be used in production in a very space-saving manner, having achieved the utmost of space-utilisation.
As additional advantage, two printing systems can be installed „back-to-back“ and work individually. This not only ensures a flexible and space-saving layout design, but also a significantly higher throughput rate.
The stencil printer is based on the SERIO 4000 system platform that stands for impressive scalability. Using several selected options¹), the SERIO 4000 Back to Back can be tailored to individual needs. Additional features can be added either directly during initial configuration or later on in the field. For example, the stencil printer can be extended significantly with respect to precision. With a printing repeatability of ± 20µm@6Sigma (optional), it is unique in its class.
SERIO 4000 Multistep
Printing of extremely-long PCBs.
Inaccuracy issues during manufacturing of very big PCBs appear as random print offsets, which are stretched across the overall substrate. EKRA has developed an innovative solution to minimize this effect and achieve higher accuracy by printing such PCBs in segments.
The concept suggests a way for the printing process to be performed in a cyclic index-manner operation. The size and layout of the segemnts can be different. Segment 2 must be longer than segment 1, 3.
SERIO 5000 Printer Platform
The printing system SERIO 5000 is based on a platform concept. This means that the printing system can be equipped with multiple options and features and adapted flexibly for individual needs at any time. Future extensions can be adapted during the first configuration or later during day to day production.
The SERIO 5000 platform is designed for challenging tasks which requires a high printing accuracy and an excellent quality of the final product.
With a cycle time of seven seconds (plus process time), the SERIO 5000 is one of the most accurate and fastest printers in its class. In addition the automatic paste height control and the variable clamping pressure for side-clamping of the printed circuit boards, a temperature sensor and a humidity sensor are included in the standard version.
SERIO 5000 Back to Back Fully-Automatic
The SERIO 5000 Back to Back printing system is pointing the way, when there is a demand for floor-space. Due to its small footprint and smart design, the printer can be used in production in a very space-saving manner, having achieved the utmost of space-utilisation.
As additional advantage, two printing systems can be installed „back-to-back“ and work individually. This not only ensures a flexible and space-saving layout design, but also a significantly higher throughput rate.
The stencil printer is based on the SERIO 5000 system platform that stands for impressive scalability. Using several selected options¹), the SERIO 5000 Back to Back can be tailored to individual needs. Additional features can be added either directly during initial configuration or later on in the field. For example, the stencil printer can be extended significantly with respect to precision. With a printing repeatability of ± 20µm@6Sigma, it is unique in its class.
SERIO 8000 Fully-Automatic
The SERIO 8000 automatic screen and stencil printing system is specially designed for printing of very large substrates. The SERIO 8000 features the exceptional EKRA ease of use and flexibility which are unmatched. The printer can be used for solder paste or glue applications onto super large substrates with a size up to 1000 x 610 mm (40 x 24 inches).
The screen and stencil holder has a flexible design which allows it to be used with virtually any kind of stencil or screen with size up to 1270 x 1700 mm (50 x 67 inches), without using of additional adapters.
The patented optical positioning system EVA™ (EKRA Vision Alignment System) features 2 high-resolution cameras with “Look-up + Look-down”technology for reliable recognition of low contrast fiducials and surfaces.
Thanks to the closed-loop regulation of the dual squeegee print head, the print pressure stays constant throughout the complete printing process and it is independent from the substrate characteristics and the print parameters.
With the optionally available automatic 2½ D post-print inspection, the location and quality of the printed glue or solder paste can be checked and - compared to the traditional 2D-Systems -a qualified feedback in regards to the printed volume of the pad and possible height deviations is directly determined.
The M2H semi-automatic screen printer has been designed for printing of ceramic hybrids in applications with small to medium size production volumes, R&D and laboratory as well as prototyping purposes.
But also a large variety of other flexible and rigid substrates up to a size of 180 x 160 mm can be processed on the M2H. The substrates can be placed on to different types of print nests mounted on the horizontally moving table. For a convenient substrate alignment, the printer can optionally be equipped with the manual optical positioning system MOPS. The substrate is then manually aligned using high resolution cameras for reliable recognition of fiducials or other layout features.
The easy to use Microsoft Windows based software allows for storage of all process relevant data. This process relevant data can easily be recalled again for quickest product changeovers.
Different squeegee types and materials can be selected according to the printing requirements. For printing of Green Tapes or other kind of flexible foils the so called “porous stone” can be used as print nest.
The 3D screen printing system “XH3D“, a machine type out of EKRA´s unique 3D Printer platform. By using stencil- or screen technology, it generates complex 3D structures on an base plate.
According to the actual printed layer height, the machine adjusts automatically the snap off distance.
Optionally the machine communicates with the patented screen exchange unit. The capacity of the unit allows to store up to 10 screens.
The base plate for the 3D compenent print, can be fixed by vacuum, direct at the movable print table. An optional drying system can be placed beside the machine to cure the actual layer.
Fastest cycle times and High Precision are the key features of the fully automated XH1 screen printer. The XH1 is the high-end solution for printing of ceramic substrates.
Its design is unique on the market and is based on excellent experience over many decades in the hybrid market.
The overall throughput of the system is in the range of 3,2 s including printing and is not only the result of a short handling time but includes as well the fully automated screen alignment. The extremely easy product changeover can be reduced to about 1 min and can be performed as well by low level instructed operators.
The alignment of the substrate is performed via the EKRA patented edge recognition. Therefore 3 cameras (alternatively 5) are mounted underneath the print nest and lookup to the substrate edges through sapphire glass modules. The light sources are as well incorporated in the sapphire glass modules. The coordinates of the recognized substrate edges are stored and according to this coordinates the screen is adjusted with a alignment repeatability of ± 12,5µm @ 6 Sigma.
The XH2 screen and stencil print system has been specially developed for printing hybrids, with a particular emphasis on combining highest precision with maximum flexibility. This inline print system utilizes the patented EVA™ –EKRA Vision Alignment System. The EVA™system is an optical positioning system with a free-moving camera. Both the camera axis and the screen adjustment assembly have integrated high precision measuring systems which together ensure a repeatability of ± 12,5µm@ 6 Sigma.
To ensure the highest possible flexibility, different methods of substrate position detection can be selected for the camera system. For substrates with polished surfaces, an edge detection system is selected and if structures such as fiducials, holes, or print images are to be used for positioning, then fiducial recognition can be selected. This versatile camera system even has the capability to position the substrate using synthetic fiducials, a method which minimizes tolerances created by previous process steps.
A particular advantage of this print system is that no mechanical centering is required, allowing stress-free processing of the fragile substrates.
Thanks to the closed-loop adjustment of both print heads, the programmed squeegee pressure remains constant throughout the entire printing path, independent of the substrate properties and the print parameters. Depending on the required print-process, a number different squeegee profiles can be selected.
SERIO XM manual
The XM is a manual screen and stencil printer dedicated to small batch size production and prototyping purposes. The sideways guided squeegee traverse and the adjustable squeegee pressure ensure a constant, high quality print. Simple operation and short set-up times all belong to the application oriented concept. Stiff as well as flexible materials such as PCBs, glass, ceramic or metal up to a thickness of 30 mm can be printed. Due to these characteristics the XM print system is the ideal application for small batch series and for prototyping.
HYCON XW Wafer Printing Cell
The flexible machining cell is designed for front or back side printing (bumping or wafer backside coating) on round wafers. The system consists of two main modules, a loading unit and a printing system. The loading unit in turn consists of three components: a magazine unloading system, a robot unit and a pre-align station. The magazine unloading system is equipped with two magazine positions from where the wafers are fed to the machine. The 3-axis robot unit with vacuum end effector ensures a stress-free wafer transport. Using a flexible pick-up, different end effectors can be used even for very thin or curved wafers.
After taking a wafer from the magazine, it is placed re-positioned in the built-in pre-align station via flat or notch recognition for subsequent printing. The wafer is then place by the wafer robot into a vacuum printing nest and then lowered and fixed. After transporting the printing table into the printer, the fiducials are detected by the moving camera and the screen or stencil is fine-adjusted.
Printed wafers can now be transported back to a magazine or removed individually with a drawer system. Optionally, processed wafers can also be fed automatically to other machines by a transport system.
Subsequent process steps, such as heat treatment, can optionally be integrated in or on the loading cell. OCR or camera reading systems are available for identification of any text on the wafers or 1D/2D codes. Communication of the cell through the SECS-GEM protocol or connection to custom MES systems is possible as options.
INSIGNUM 1000 Scan Reading System
The Reading System, INSIGNUM 1000 Scan, is a conveyor with manually adjustable scanner axis. The product is transported on the conveyor and can be transported up against a stopper. The optional scanner which is mounted on a manually adjustable X/Y-axis is triggered and then transfers the data directly to an external system. After the scanning process, the product is transported to the following unit.
INSIGNUM 3000 Label Automatic Label applicator
The Label applicator, INSIGNUM 3000 Label, consists of a servo driven X/Y axle, a rotating application head and a conveyor with positioning mechanism to pick up and place the PCBs. The PCB is transferred with a conveyor into the application area. The X/Y axle moves the application head to the printer, a label is taken and then applied to the PCB. After the application process the PCB is released and then transferred to the following unit.
INSIGNUM Variety Inline Laser Marking System
The INSIGNUM Variety is a fl exible system for marking and cutting labels via laser. In contrast to standard systems, the machine can mark many different types of materials and apply the labels onto components with variable heights. A particular highlight is the machine's ability to mark any label size. A laser-markable foil is fed from a roll into the machine. The laser subsequently marks the foil and cuts it to the required size in one step. The machine thus combines the best features of labelling and laser marking into one system. To reach the required accuracy, a camera system fi rst measures the label. Using an adjustable servo driven axis in X, Y and Z, the label is positioned and applied to components up to a height of 40 mm in one continuous process. To ensure easy maintenance and handling, the label feeder is installed in a drawer which can be pulled out when new material is required. Product- specific data and labels can be configured and saved via the machine software.
INSIGNUM 3000 Scan Reading System
The Reading System, INSIGNUM 3000 Scan, consists of a stepper motor driven X/Y-axle-system with scanner. The product is transported on the conveyor and up against a stopper. The scanner moves into position dependent upon the product, and scans the barcode or the data-matrix code and transmits the information to the database or the network.
INSIGNUM 6000 Laser Automatic Marking System
The flexible INSIGNUM 6000 platform implements customer-specific requirements in the laser marking field. This includes model variants for double track solutions, the processing of large-size PCBs and the marking of e.g. ceramics, plastics and DBC substrates. Module sizes smaller than 3mil can also be realized. Transport system and laser types are individually adapted to the process requirements.
In the basic version, the system is equipped with a 10 Watt CO 2 laser and a transport system. On request, the system can also be equipped with fiber laser.
INSIGNUM 3000 Laser Automatic Marking System
The ASYS inline Laser Marking System, INSIGNUM 3000 Laser, is used for direct laser marking of solder resist on PCBs. The laser assembly is mounted above the transport system on a servo-driven X/Y axis. The PCB to be marked is taken over onto the transport system and transported into the marking position. The laser now moves to a pre-programmed position and marks the predefined content, such as barcode, datamatrix codes, plain text or logos onto the product.
DIVISIO 1000 Semi-Automatic Depaneling System
The DIVISIO 1000 is the ideal entry-level machine for low-stress, automatic PCB depaneling applications. With a footprint of only 1.2 m² and a working area of 2 times 350 mm x 400 mm, it is the smallest solution for depaneling with a milling cutter. The machine is ideal for the production of prototypes, small batches and as a backup for inline production.
The dynamic milling axis is installed above the 2 drawer shuttle system. The X and Y-axis are driven with linear motors whereas the Z-axis is pneumatic driven. What makes this system particularly interesting is the standard integration of a camera system for fiducial recognition and image guided program generation.
DIVISIO 2000/2100/2300 Semi-automatic Depaneling System
All systems of the DIVISIO 2000 Series can optionally be equipped with a robot interface. This interface allows the semi-automatic systems to be loaded and unloaded fully automatically. The DIVISIO 2000 is a semi-automatic system for stress-free depaneling of PCBs. The X- and Y-axes are both equipped with highly dynamic linear motor technology, the Z-axis is servo-driven. Already existing product carrier adapters can easily be used with this machine. The vacuum system is optimized with the help of the Tornado-Effect.
The system offers a cost-efficient solution for customers who wish to depanel stress-free but who do not produce such a high volume to justify the acquisition of an inline machine. By positioning the routing axis either above or below the electrically driven rotary table the DIVISIO 2100 has the flexibility to represent a verified production process. It can therefore be used without any restrictions as back-up for the inline production. The DIVISIO 2300 commands the largest working area within the entire DIVISIO depaneling systems.
DIVISIO 2200 Semi-Automatic Depaneling System
The DIVISIO 2200 is a semi-automatic depaneling system with manual load-/unloading utilizing a single shuttle system. Using only one working area allows a higher flexibility because the available PCB area can be increased compared to other machines. This means that the DIVISIO 2200 is especially suitable for low volume manufacturing with a high product mix. Another field of application is prototyping. High technology panelized printed circuit boards require a precise stress free depanelizing process to prevent damage of the PCBs. The depaneling system is based on a rigid, stable substructure of welded steel construction. Due to its stability, this frame base absorbs the speeds of the integrated linear motors and assures a fast, accurate and smooth operation. At this split axes system the spindle is mounted on the X/Z-axis on top side of the routing level. The Y-axis moves the fixture. The panel sits in a fixture during the cutting process (option). An operator loads and unloads the fixture into the drawer manual. The automatic router-bit exchange can handle the 4-fold router-bit magazine.
DIVISIO 3100 Compact Depaneling System
The DIVISIO 3100 is an automatic inline depaneling system with the smallest footprint. It is the ideal solution for separating single-row, frameless panels. The machine has an X/Y/Z-axis system above the transport level and can be equipped with a saw or router. PCB positioning is done with an integrated stopper unit mounted at the X-axis. Therefore routing could be done at free definable Y-positions. Restriction is that no waste could be handled (e.g. borders, waste corners). With the devided transport system inside the machine the PCB can be separated. Subsequently the cut PCB can be transfered out of the machine. The manual width adjustment is done by a clamping lever.
DIVISIO 4000 Automatic Inline Depaneling System
The DIVISIO 4000 is a unit for high volumes and a small product mix. Arriving panels are transferred to a conveyor where they are lifted up and then picked up by the gripper adapter. The cutting tool (spindle or saw) is mounted in a fixed position into the unit and the panel then travels over it. A double spindle can also be installed to increase productivity. The unloading conveyor can either be a flat belt conveyor, a double belt conveyor, product carrier, shuttle or a combination of them.
DIVISIO 5000/5100 Automatic Depaneling System
The DIVISIO 5000/5100 is top of its class in flexible, high-speed depaneling systems.
The machine is only 1000mm / 1200mm long and has a working area of 330 x 350mm / 460 x 460mm. The modular frame construction leaves enough room for installation of for example a carrier circulating system or an underfloor conveyor with integrated lift device. The machine consists of 2 lanes which can be configured according to the customer's demands. The PCB panel enters the machine on lane 1 where it is routed and the routed PCBs are subsequently transferred via a gripper to lane 2. The handling gripper axis is made of carbon fiber reinforced plastic, ensuring high stiffness and accuracy.
DIVISIO 5100 Automatic Depaneling System
The machine works autonomously and under constant self-monitoring. This increases the production time by four hours per week and it can be produced in 20.5 shifts. Thus, up to 150,000 more pieces can be produced annually. All operating resources are checked for correctness before production starts in order to increase process reliability. Thanks to an automatic product change, the autonomous time of the depaneling unit is increased. This is another milestone on the way to a smart factory. Open interfaces enable connections to other plants and (control) systems, e.g. via OPC UA. User-configurable dashboards display all important parameters on the SIMPLEX HMI.
Cycle times of less than two seconds per individual switching effortlessly meet any benchmark. The handling system made of carbon fiber with linear motor drive sets standards in positioning accuracy and dynamics. Thanks to the soft-stop function, the workpiece is positioned stress-free and gently in the machining area. All discharge variants such as shuttle systems, carriers circulation, full-surface belts, etc. can be integrated modularly and operate the subsequent process. Thanks to the modular design and BUS technology, further options can also be retrofitted very easily at a later date. The decentralized integrated switch cabinet ensures a small footprint and best accessibility.
DIVISIO 5100 Dual Automatic Depaneling System
The DIVISIO 5100 Dual is top of its class in flexible, high-speed depaneling systems.
The machine is only 1200mm long and has two workingareas of 330mm x 250mm. The modular frame construction leaves enough room for installation of for example a carrier circulating system or an underfloor conveyor with integrated lift device. The system has two inlet and two outlet conveyors. Thereby the system is able to work on two different products by a demand-driven process. Due to the requirement of smaller footprint the switch cabinet is on top (option). The handling gripper axis is made of carbon fiber reinforced plastic, ensuring high stiffness and accuracy.
DIVISIO 6000 Automatic Rotary Table Depaneling System
The DIVISIO 6000 is a high dynamic depaneling system for maximum output. The module units are split in the following processes: “depaneling“, “final assembly“ and “feeding next process“. By this it is possible to adapt to speed or process-applications.
The cut curcuits will be laid down on the centrally placed turntable by the carbon-fibre-axis in the front. The “final assembly“ is carried out on the turntable. At the same time the second carbon-fibre-axis takes the finished circuits at the other side of the table and sorts them into a freely choosable outlet.
By using parallel processes the DIVISIO 6000 can run optimum cycle times.
POLYPHOS DP 8000 Series Laser Depaneling
The POLYPHOS DP 8000 Series is a machine platform for laser depaneling of rigid and flex PCBs. A hard stone base allows for maximum stability and precision. Different beam sources are available to adapt the laser cutting process to the substrate material. The system is available as a stand-alone manual loading system or fully automated inline. For inline operation various product specific carrier transport and fixture systems are available. Camera vision is used for machine calibration and offset correction by fiducials.
The system uses a precise XY-stage and a digital controlled galvo scanner for a step&scan process to optimize through-put and accuracy.
POLYPHOS DP 9000 Series Laser Cutting
POLYPHOS DP 9000系列是一种用于高通量刚性和柔性电路板的经济高效的机器平台。光束源为绿波二极管泵浦固体激光器，专门用于FR4材料的有效分离。该系统是一个全自动内联系统，只需要很小的占地面积。各种特定于产品的承运人运输系统可用于自动化。柔性或刚性利益的固定最好通过真空进行。该机器为ASYS生产率概念做好准备，以实现非常高的吞吐量。对于使用基准点的机器校准和偏移校正，使用具有自主开发的工业图像处理的相机系统。该系统使用数字控制的振镜扫描仪，以实现高速和低漂移动态，从而实现高精度。
POLYPHOS CT 7000 Laser Cutting
ASYS provides a broad product line of depaneling solutions that range from semi-automatic to high-end inline systems. The ergonomically designed POLYPHOS CT 7000 Laser Cutting System is equipped with the latest laser technology. During development, special emphasis was placed on safety, easy operation and a reduced footprint. The POLYPHOS CT Series is a machine platform for laser cutting of metal core PCBs, respectively IMS (Insulated Metal Substrate) for e.g. LED luminaires or ceramic substrates like power semiconductors on DCB substrates. The system consists of a CNC-controlled machine with a precision cutting head to position the laser beam. Assist gas supports the cutting process. Depending on the application different gases can be used. A camera is used for machine calibration and offset correction using fiducials.
S10 Modular Stencil Storage System
The S10 modular system is an easy to upgrade stencil storage system, specifically focused on flexibility. For a proper storage of stencils, the S10 modular system is equipped with two swing doors and a twist locker. The inner design of the S10 modular can individually be configured and can accommodate frameless as well as framed stencils of all common sizes from 20 up to 29 inch (737 mm).
The individual modules could be mounted on top of each other (3 modules), in order to ensure all stencils always fitting into the same system. A stainless steel working plate on top of the S10 modular enables an easy and fast commissioning and handling of stencils before and after their use.
For stencils > 29” (737 mm), EKRA offers with the S10 modular XXL a version, which can accommodate framed stencils up to an outer dimension of 950 mm.
S10 Mobile Set-Up and Storage System
This mobile set-up and storage system is designed for versatility, flexibility and expandability and is an universal system for the various processes in the electronic manufacturing.
Equipped with detailed smart solutions, the S10 mobile system is designed to facilitate the work-flow in the electronic manufacturing of today. The mobile always offers proper opportunities to quickly provide the necessary tools and accessories right atthe process machine. On the side cover a grab handle allows for a convenient and easy handling of the S10 mobile system, also over longer distances. Therefore the required tools and accessories for a process, e.g. screens, stencils, squeegees, support systems or cleaning materials are always within reach.
The inner design of the S10 mobile system can individually be separated and arranged. For this purpose, EKRA offers various extensions and options. On the robust and easy to clean stainless steel working plate necessary set-up and change-over works can be done in close proximity to the process machine.
An optionally deposition rack on top of the working plate enables a quick provision of e.g. solder paste containers, cleaning paper boxes and others.
S10 select Material supply system
MHW – Trolley
The manual trolley has a roller conveyor to handle and transfer transport goods between several sources and targets. The orientation of the roller conveyor is crosswise to the driving direction of the trolley. The system is optimized to handle containers, like PCB-Magazines, SMD-Reel-Containers, KLT-Boxes or consumables at the shop floor. The platform is available in two dimensions, to provide a universal platform for diferent materials and container dimensions.
MSL Scan & Label
The Scan & Label is an inline material receiving station with smart software functionalities for an autonomous material detection, allocation of the Unique ID (UID) and the application of a label for unique identifi cation. The system can be used at the inbound area, but also at the inlet of a automatic storage system, like the Dry Tower, to connect the inbound and storage process. There are diferent inbound systems available, which can be integrated in the Scan & Label system.
The Reel-Magazines are fi lled in the Reel-Magazine-Loader by feeding the individual component reels coming from the Dry Tower via a cross pusher from the reel section of the system and, depending on the confi guration of the reel magazine, placing them into this. Up to two magazines can be placed on the line in parallel.
Using a special reel magazine container, the component reels are provided as needed, at the right time, in the right quantity, at the right place - to the operator directly on the line. For unique identification, the reel magazine has an RFID tag with a unique container ID.
The M-Station-Reel is a modular roller conveyor system to bufer transport goods, especially component reels and JEDEC tray stacks. The M-Station-Reel is divided in independent segments, with a number of 1, 2 or 3 segments. The handover and takeover process can be done manually by an operator or via the HERMES interface. There are several applications available, like a usage as transfer or buf er system to connect inbound systems or storage systems, e.g. Dry Tower. The modular concept allows to extend the system, depending on the number of required positions.
Reel-Container / Reel-Tray-Container
The Reel-Container is a container to hold a certain number of component reels. The exact number depends on the thinkness of the reels. The centering of the component reels is done via the standardized central hole in the reels, which are fixed via the spike of the container. The Reel-Tray-Container can also hold JEDEC trays in addition to the component reels. The trays are stored at one side of the spike, guided by additional rails in the container. The reels/trays can be loaded/unloaded manually or by a MLO Loading or MUL Unloading system.
M-Station Pick-by-Light 灯光拣选站安装在拣选和放置系统附近，作为补充拣选和放置机器的接口。M-Station Pick by Light最多可容纳两个卷筒料斗。填充的卷盘库将呈现给操作员，下一个所需的组件卷盘将通过“按光拾取”功能可视化。为此，可通过LED灯条显示所需卷盘的等级，从而有针对性地指导操作员。消除了确定所需辊的搜索和行程时间，并可根据消耗量和需求重新供应放置系统。转移和接管过程可由操作员、手推车或自主移动机器人手动执行。
MLO (装货单元) / MUL (卸货单元)
MTPQ – 自主导航移动机器人 AMR 平台
以AMR系统为基础的ASYS MTPQ运输平台是一种自主导航移动机器人（AMR），设计用于运输任何类型的材料。该系统经过优化，可在车间处理容器，如PCB盒、SMD卷盘容器、KLT盒或耗材。ASYS AMR系统可识别障碍物，并自动在障碍物上进行模糊识别，并找到最佳路线以达到其运输目标。该平台有多种尺寸，可为不同材料和容器尺寸提供通用平台。
MTPL – 自主导航移动机器人 AMR 平台
以AMR系统为基础的ASYS MTPL运输平台是一种自主导航移动机器人（AMR），设计用于运输任何类型的材料。该系统经过优化，可在车间处理容器，如PCB盒、SMD卷盘容器、KLT盒或耗材。ASYS AMR系统可识别障碍物，并自动在障碍物上进行模糊识别，并找到最佳路线以达到其运输目标。该平台有多种尺寸，可为不同材料和容器尺寸提供通用平台。
PARIO 500 托盘系统
PARIO 500码垛系统用于托盘堆垛的堆叠和卸垛，从而在自动化过程中有序地装载和卸载托盘。托盘堆垛与工艺机器结合或集成到生产线中，以符合人体工程学的高度装载/卸载。根据所需的布局，PARIO 500可提供直线型（基本0°）或角度型（90°）。0°版本还提供了宽度调整选项，用于多托盘宽度的混合操作。通常，PARIO 500成对使用，一个用作装载机，另一个用作卸载机。除了已经提到的两个版本外，还有一些特殊物流概念的版本，如电车。在这里，PARIO在高度高达1400mm的手推车上堆叠或卸下托盘堆叠。通过使不同工作高度相等的升降机，PARIO 500还可以通过AIV装载和卸载托盘。
PARIO 700 flex 托盘处理概念缓冲系统
托盘处理系统PARIO 700 flex在自动化生产线中缓冲托盘。系统对接到流程系统。该系统可在制造过程中独立装卸托盘，从而实现高效操作和简单快速的系统设置。一个托盘放置在PARIO 700 flex的装载输送机上。提升输送机将托盘输送至缓冲器中的特定位置。如果停靠的处理系统请求托盘，托盘将从缓冲器中取出，并可在处理系统的下部轨道上进行装载或卸载。或者也可以通过单独的访问加载和卸载整个缓冲区。
PARIO 800 码垛系统
PARIO 800码垛系统用于堆叠和卸载托盘，从而在自动化过程中有序地进料和卸载托盘。PARIO 800用作一台机器，因为托盘堆叠已集成到一台机器中，请参见侧面的原理图。通常，空托盘堆放置在上部传送带上，分离并转移到加工机器。这将装载托盘，将其返回到PARIO 800，PARIO 800依次堆叠托盘并通过下部传送带进行分配。根据需求，此过程也可以按相反的方向（从下到上）实施。对于PARIO 800，有可选的自主扩展，或者可以通过带托盘的AIV通过升降机进行处理，以补偿不同的工作高度。
PARIO 1000 托盘系统
PARIO 1000是一个集成托盘和部件处理托盘系统。与所有PARIO一样，它用于堆叠和卸下托盘，但也可以通过拾取和放置将托盘中的零件插入到工艺链中，或从中移除。此处的选项根据客户的要求而有所不同，从工件托架、穿梭机或传送带中的放置/移除，到扫描或清洁等中间工作步骤，再到基于摄像头的特征识别。可以处理最大尺寸为400 x 600mm的托盘格式。根据任务和要求，PARIO 1000可以用作独立机器或与其他PARIO组合使用
PARIO 2000 托盘系统
PARIO 2000通过配备的托盘从外部手动加载。托盘堆垛自动移动到托盘堆垛机中，托盘堆垛在托盘堆垛机中分离。安装在Y-Z系统上的夹具将产品取出并放置在装配线上。空托盘堆放在托盘堆中，并在工艺结束时自动从机器中取出。PARIO 2000可用于托盘的装载或卸载。
PARIO 3000 高端托盘处理系统
托盘和组件搬运–从最小的托盘到欧洲托盘–PARIO系列涵盖所有应用领域。高端PARIO 3000托盘处理系统可处理高达400 x 600 mm的托盘格式，并确保最短的托盘更换时间。系统在不到四秒钟的时间内卸载或装载托盘。高端托盘处理系统PARIO 3000由配备托盘的外部手动加载。托盘堆垛自动移动到托盘堆垛机中，托盘堆垛在托盘堆垛机中分离。安装在Y-Z系统上的夹持器系统移除产品并将其放置在装配线上。空托盘堆放在托盘堆中，并在工艺结束时自动从机器中取出。PARIO 3000可用于托盘的装载或卸载。PARIO 3000具有优化的性能和单工多点触摸用户界面：
PARIO 4000 托盘系统
PARIO 4000 3轴码垛机具有集成组件搬运功能，可在批量生产中进行优化。它是为基于标准滚道（小车）的内部物流而设计的。以堆叠托盘形式在手推车上交付的部件，高度高达1400 mm，可直接推入PARIO 4000或通过任何进一步的重新包装移除。因此，PARIO是物流链的一个组成部分。这一概念及其高度的自主性为自动装配线的装卸提供了最佳的码垛机。装载和卸载是托盘和零件处理的平行和独立过程。在MES/ERP系统注册物料后，托盘处理系统从上方取出一个托盘，并将其放置在暂存模块的自由托盘穿梭机上。与空托盘交替，满托盘进入零件处理系统。在那里，将部件从托盘上拆下，并根据需要放置在产品托架中或执行另一个装配步骤。集成传输系统将部件传输到下一台机器。空托盘留在穿梭机上，由托盘处理系统接管并添加到空托盘堆栈中。从那里，它被返回到托盘循环，当然也是在手推车上。整个过程可连接到MES/ERP系统，或通过PULSE PRO软件套件中的智能警报进行监控。PARIO 4000可根据需要用于托盘堆垛的装载或卸载。
PARIO 5000 托盘系统
PARIO Tray Lift
_对于400 x 600 mm以下的托盘
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PULSE PRO 软件，包含七类软件模块，它能帮助您控制车间的自动化物料流，确保您实现每台机器的物料供应动态化，实时化，此外所有生产数据流，随时供您过目。您可以通过控制台轻松操作PULSE PRO软件，完全采用傻瓜式操作。 如此高质量，高效率的操作，是基于操作员任务派发模式。无论您面对多么复杂的工厂情况，PULSE PRO都能帮助您快速又轻松地发现问题并解决问题。
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